home
繁體中文 | 简体中文 | English | 日本語
R&D Headquarter
Technology Roadmap
Manufacturing Process
Process Capability
Equipment Introduction
Home | Technical Support | Process Capability
  • IMAGE TRANSFER
  • MECHANICAL
  • CHEMICAL
  • FINAL INSPECTION
Equipment Capability
Inner Layer Inner Layer Coating Max size:590 x 610 mm
Dry Flim Exposure Max size:540 x 610 mm
AOI AOI Max size:660 x710 mm
Solder Mask Printing Line Max size:590 x 610 mm
Exposure Machine Max size:590 x 610 mm
Equipment Capability
Lamination Brown Oxide Max size:620 x 540 mm
Hot Press Max size:600 x 500 mm
Laser Drilling Laser Drilling Machine Max size:620 x 560 mm
Drilling Drilling Machine Max size:570 x 650 mm
Legend Printer Max size :600 x 700 mm
CNC Routing Machine Max size: 650 x 550mm
Golden Finger Chamfering Max size: 450 x 450mm
V-CUT Min size: 40 x 40mm
Max size: 650 x 650mm
Equipment Capability
PTH PTH Max size : 618 mm
DMS-E Min size:250 x 250 mm
Max size:540 x 610 mm
Panel Plating VCP Min size:330 x 500 mm
Max size:580 x 610 mm
DES DES Line Max size : 640 mm
Pattern Plating Pattern Plating Min size:100 x 480 mm
Max size:620 x 620 mm
SES SES Line Max size : 650 mm
Surface Treatment ENIG Max size:630 x 630 mm
Gold Finger Max size :640*540 mm
IMS Max size :600mm
OSP Max size :600mm
Equipment Capability
O/S Test Universal QD:Max size:325 x 240mm
DD:Max size:500 x 320mm
Dedicate Max size: 500 x 600mm
Fly Probe Max size: 610 x 460mm
Final Inspection AVI Min size :80 x 80mm
Max size :250 x 330mm
Copyright © 2008-2009 DYnamic Electronics Co., Ltd.All Rights Reserved webmail
No.356.Shan lng Rd., Guei Shan, Taoyuan Taiwan 333 Kuei-Shan Hsiang, Tao Yuan County, Taiwan,R.O.C. TEL:+886-3-349-3300 FAX:886-3-359-5132 　　　Designed by ERSOFT.