| Technology Roadmap |
|
Conventional |
|
HDI |
|
| |
 |
 |
 |
Max. layer count
Build up structure |
20 |
3+NB+3 |
24 |
Any Layer / Stacked Via |
28 |
Any Layer / Stacked Via |
PCB thickness
(min/max, mil) |
10 / 128 |
14 / 96 |
8 / 128 |
12 / 128 |
6 / 128 |
10 / 128 |
| Min. IL-core thickness(mil) |
2 |
2 |
2 |
2 |
2 |
2 |
| Min. line width/space(mil) |
3/3 |
2/3 |
3/3 |
2/2 |
3/3 |
2/2 |
Min. drill. hole
(PTH/µ-via, mil) |
6 |
4 |
4 |
3 |
4 |
3 |
Finished aspect ratio
(PTH/µ-via) |
10:1 |
1:1 |
10:1 |
1:1 |
10:1 |
1:1 |
| Impedance |
+/-8% |
+/-8% |
+/-8% |
+/-8% |
+/-6% |
+/-6% |
Min. S/M clearance
(mil) |
1.5 |
1.5 |
1.5 |
1.5 |
1.5 |
1.5 |
| |
 |
| Standard and extended |
FR4 (TG 135-175°), Halogen free, Low z-axis expansion |
| Heavy copper |
2 – 6 oz |
| High frequency |
Ceramic |
| Thermal management |
Metal Core PCB |
